AUTO-3-AXIS-AB-GLUE-DISPENSING-SYSTEM
點膠機器人
桌面型自動熱熔膠點膠機 高精度電子裝配設備 WPM-334
技術參數
- 型號
- WPM-334
- 產品名稱
- Glue Dispenser with R Axis
- 工作壓力
- 4-7kgf/cm
- 適用黏度
- 1-1,000,000cps
- 出膠量
- 0.01ml
- 產品材質
- Aluminum alloy
無與倫比的高精度和持久的耐用性: 旨在長期提供一致和可靠的性能。該機器的核心採用精密閥芯 ,確保準確且可重複的分配體積低至0.01毫升 。這款分配器採用高端配件 ,採用耐磨和耐腐蝕材料製成 ,使用壽命長 ,可最大限度地減少停機時間並最大限度地提高您的投資回報。專業 製作,專業技術和穩定的品質: 受益於數十年的行業專業知識和一絲不苟的工藝。該機器以豐富的行業生產經驗 為基礎,由技術嫻熟的專業人員 組裝。其緊湊的結構 、專業的拋光 和嚴格的品質控制流程保證了穩定和一致的品質 ,為您提供值得信賴的可靠和可靠的點膠解決方案,用於關鍵的電子組裝任務。緊湊的尺寸和輕巧的設計,輕鬆作: 最大限度地提高作員的舒適度,並簡化與任何工作空間的集成。小巧的尺寸和輕巧的設計 使該機器非常易於作和作 。 其緊湊的佔地面積允許無縫集成到桌面中 工作站和生產線,而其輕巧的特性 簡化了設置和重新置放。適用於各種應用的多功能針頭相容性: 適應各種點膠要求。本機設計適用範圍廣 ,可連接各種標準針 頭。 這種多功能性確保了與各種膠粘劑的相容性 粘度和應用類型,使您能夠處理各種 電子元件組裝任務使用一台適應性強的機器完成。整合 R 軸以增強應用靈活性(帶 R 軸的點膠機): 透過整合的R 軸 功能擴展您的分配能力 。這台機器被命名為「帶 R 軸的點膠機」 建議包括一個旋轉軸(R 軸)。 此功能可能支援旋轉分配 、 允許圓形圖案、分配等應用 圓柱形元件,或點膠的精確角度定位 針。這個增加的軸增強了機器的多功能性,並允許 對於某些需要的更複雜和專業的分配模式 電子元件。(在更詳細的規格表中進一步闡明 R 軸的具體功能將是有益的)。 Precise Bonding, Filling, Sealing, Dripping, and Coating for Electronic Components: Engineered for the specific demands of electronic component manufacturing. This machine excels at applyingglue and other liquids with precision for a variety of crucial electronic assembly processes, including:Precise Bonding: Securely bonding electronic components to PCBs and housings.Accurate Filling: Filling gaps and cavities with adhesive for insulation and protection.Reliable Sealing: Creating airtight and waterproof seals for sensitive electronic devices.Controlled Dripping: Applying precise droplets of adhesive for micro-bonding and component attachment.Uniform Linear/Arc-Shaped/Circular Coating: Applying consistent coatings for protection, insulation, and environmental sealing of electronic assemblies.
Optimized for Electronic Industry Applications: Specifically tailored to the needs of the electronic manufacturing sector. ThisDesktop Automatic Hot Melt Glue Dispensing Machine For Electronic Industry andMelt Glue Dispensing Machine For Electronic Industry are clearly targeted for applications within the electronics industry, emphasizing its suitability for the delicate and precise nature of electronic component assembly and manufacturing.
PCB (Printed Circuit Board) Assembly: Precise bonding and encapsulation of components, application of solder paste, and conformal coating.Semiconductor Packaging: Chip bonding, wire bonding encapsulation, and precise adhesive application in semiconductor device manufacturing.Consumer Electronics Manufacturing: Bonding components in smartphones, laptops, tablets, and other consumer electronic devices.Automotive Electronics Assembly: Reliable adhesive application for electronic control units (ECUs), sensors, and other automotive electronic components.LED Lighting Manufacturing: Precise adhesive application for LED die bonding, lens attachment, and environmental sealing of LED lighting products.Sensor Manufacturing: Accurate and consistent adhesive application for sensor assembly and encapsulation, ensuring sensor performance and environmental protection.Any electronic manufacturing process requiring precise, repeatable, and reliable adhesive dispensing.












Glue Dispensing Machine WPM-334 — Demo Video
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